Features:

. Cluster type structure, can complete the same operation in different chambers , also can complete different operations in different chambers .

. Temperature range: 360°C~550°C.

.  Kinds of films: SiNx, SiOx, SiOx, SiONx, a-Si, etc.

.  Can be utilized in LTPS PECVD process as well as flexible packaging process.

. Film non-uniformity: ≤ 5%.

. Automatic FM matching system: RF stabilization time ≤ 0.1s with either 13.56 or 40.68 MHz.

.  Dual vacuum design

.  Ultra-clean environment without cross contamination.

.  Equipped with plasma self-cleaning system, no need to open the chamber for maintenance.